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  • Name: RW-SV550 S...
  • Number: RW-SV550
  • Time: 2015-12-12
  • Views : 224

1.Hot air heater head and mounting head are designed 2 in 1, driven by step electric motor, have both the
  auto soldering and mounting function;
2.Three heaters( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature
  can be displayed digitally on touch screen;
3.Upper heater is movable, convenient for operation;
4.Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the max
  PCB size it can handle up to 550*500mm;
5. Powerful cross flow fans cool the bottom heating area rapidly with stable speed;
6. Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration
   detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA
   sized up to 70*70mm;
7. Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display
   set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles;
8.Color LCD monitor;
9. Built-in vacuum pump,  60 °rotation in φ angle, mounting nozzle is micro-adjustable;
10.8 segments of temperature up(down) and 8 segments constant temperature control,  profile saving is unli
   -mited in the industrial computer;
11.Suction nozzle can identify material and mounting height automatically,  and can control the air pressure
   within a small range of 30-50g;
12.Equipped with different hot air nozzles,  easy to replace and able to locate in any angle.
PCB dimension:W20*D20~W550*500
PCB thickness:0.5~4mm
Working table adjustment:: ±120mm Forward/backward, ±80mm Left/right
Temperature control: K-type Thermocouple:Close Close Cycle Controlled
Area heater: Far infrared: 3600W
Top heater: Hot Gas: 1200W
Bottom heater: Hot Gas: 800W
PCB locationway: Outer
Power supply: Single-phase 220v,50/60Hz
BGA dimension: 1*1~70*70mm
Min pitch of BGA ball: 0.15mm
Placement precision:  ±0.02mm
Max BGA weight:: 300g
Machine dimension: L850*W750*H630
Weight: Appox: 80kgs

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