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        Your present location:Home >> Products >> BGA Rework Station >> Optical BGA Rework Station >> RW-SV550 Semi-auto Optical BGA Rework Station
        • Name: RW-SV550 Semi-auto Optical BGA Rework Station
        • Number: RW-SV550
        • Time: 2015-12-12

        1.Hot air heater head and mounting head are designed 2 in 1, driven by step electric motor, have both the
          auto soldering and mounting function;
         
        2.Three heaters( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature
          can be displayed digitally on touch screen;
         
        3.Upper heater is movable, convenient for operation;
         
        4.Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the max
          PCB size it can handle up to 550*500mm;
         
        5. Powerful cross flow fans cool the bottom heating area rapidly with stable speed;
         
        6. Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration
           detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA
           sized up to 70*70mm;
         
        7. Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display
           set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles;
         
        8.Color LCD monitor;
         
        9. Built-in vacuum pump,  60 °rotation in φ angle, mounting nozzle is micro-adjustable;
         
        10.8 segments of temperature up(down) and 8 segments constant temperature control,  profile saving is unli
           -mited in the industrial computer;
         
        11.Suction nozzle can identify material and mounting height automatically,  and can control the air pressure
           within a small range of 30-50g;
         
        12.Equipped with different hot air nozzles,  easy to replace and able to locate in any angle.
        PCB dimension:W20*D20~W550*500
         
        PCB thickness:0.5~4mm
         
        Working table adjustment:: ±120mm Forward/backward, ±80mm Left/right
         
        Temperature control: K-type Thermocouple:Close Close Cycle Controlled
         
        Area heater: Far infrared: 3600W
         
        Top heater: Hot Gas: 1200W
         
        Bottom heater: Hot Gas: 800W
         
        PCB locationway: Outer
         
        Power supply: Single-phase 220v,50/60Hz
         
        BGA dimension: 1*1~70*70mm
         
        Min pitch of BGA ball: 0.15mm
         
        Placement precision:  ±0.02mm
         
        Max BGA weight:: 300g
         
        Machine dimension: L850*W750*H630
         
        Weight: Appox: 80kgs

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