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        Your present location:Home >> Products >> BGA Rework Station >> Optical BGA Rework Station >> RW-SV550A Auto Optical BGA Rework Station
        • Name: RW-SV550A Auto Optical BGA Rework Station
        • Number: RW-SV550A
        • Time: 2015-12-12

        1.Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently, time and
          temperature can be displayed digitally on  touch screen;
         
        2.Optical vision system can move along with X、Y axis automatically; easy for placement and operation;
         
        3.Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the
          max PCB size it can handle up to 550×500mm;
         
        4.Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
         
        5.Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration
          detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA
          sized up to 70×70mm;
         
        6.Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display
          set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles,
          and compare them with  the history saved profiles;with USB for connecting mouse and updating software;
         
        7.Color LCD monitor; big size screen, easy to operate;
         
        8.Built-in vacuum pump; the max suction up to 80g;60 °rotation in φ angle,
         
        9.8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is
          unlimited in the industrial computer;
         
        10.Suction nozzle can identify material and mounting height automatically, and can control the air pressure
          within a small range;
         
        11.Auto pick up chip, auto solder, auto remove, auto placement;
         
        12.Alloy nozzle assures the durability and stability in reflow, able to locate in any angle;
         
        13.Visible monitoring system, can view the melting procee of the balls,(optional)
        PCB dimension:W20*D20~W550*500
         
        PCB thickness:0.5~4mm
         
        Working table adjustment:: ±120mm Forward/backward, ±80mm Left/right
         
        Temperature control: K-type Thermocouple:Close Close Cycle Controlled
         
        Area heater: Far infrared: 3600W
        Top heater: Hot Gas: 1200W
        Bottom heater: Hot Gas: 800W
         
        PCB locationway: Outer
         
        Power supply: Single-phase 220v,50/60Hz
         
        BGA dimension: 1*1~70*70mm
         
        Min pitch of BGA ball: 0.15mm
         
        Placement precision:  ±0.02mm
         
        Max BGA weight:: 300g
         
        Machine dimension: L850*W750*H630
         
        Weight: Appox: 80kgs

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