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Your present location:Home >> Products >> BGA Rework Station >> Optical BGA Rework Station >> RW-SV550A Auto Optical BGA Rework Station
1.Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently, time and
  temperature can be displayed digitally on  touch screen;
 
2.Optical vision system can move along with X、Y axis automatically; easy for placement and operation;
 
3.Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the
  max PCB size it can handle up to 550×500mm;
 
4.Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
 
5.Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration
  detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA
  sized up to 70×70mm;
 
6.Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display
  set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles,
  and compare them with  the history saved profiles;with USB for connecting mouse and updating software;
 
7.Color LCD monitor; big size screen, easy to operate;
 
8.Built-in vacuum pump; the max suction up to 80g;60 °rotation in φ angle,
 
9.8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is
  unlimited in the industrial computer;
 
10.Suction nozzle can identify material and mounting height automatically, and can control the air pressure
  within a small range;
 
11.Auto pick up chip, auto solder, auto remove, auto placement;
 
12.Alloy nozzle assures the durability and stability in reflow, able to locate in any angle;
 
13.Visible monitoring system, can view the melting procee of the balls,(optional)
PCB dimension:W20*D20~W550*500
 
PCB thickness:0.5~4mm
 
Working table adjustment:: ±120mm Forward/backward, ±80mm Left/right
 
Temperature control: K-type Thermocouple:Close Close Cycle Controlled
 
Area heater: Far infrared: 3600W
Top heater: Hot Gas: 1200W
Bottom heater: Hot Gas: 800W
 
PCB locationway: Outer
 
Power supply: Single-phase 220v,50/60Hz
 
BGA dimension: 1*1~70*70mm
 
Min pitch of BGA ball: 0.15mm
 
Placement precision:  ±0.02mm
 
Max BGA weight:: 300g
 
Machine dimension: L850*W750*H630
 
Weight: Appox: 80kgs

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